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author | Zhang Rui <rui.zhang@intel.com> | 2008-01-17 15:51:18 +0800 |
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committer | Len Brown <len.brown@intel.com> | 2008-02-01 23:21:03 -0500 |
commit | 653a00c9662304ef72a3eb4e681c91720960e0b4 (patch) | |
tree | 5773757047d5c81f8d19d17bd331a5d13734766f /Makefile | |
parent | cc0573b3250214034062ddf8c64359596d8af521 (diff) |
ACPI: thermal fixup
The alias name may be used in _PSL, _ALx and _TZD,
so we bind the cooling device only if the acpi_device node matches.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'Makefile')
0 files changed, 0 insertions, 0 deletions