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authorZhang Rui <rui.zhang@intel.com>2008-01-17 15:51:18 +0800
committerLen Brown <len.brown@intel.com>2008-02-01 23:21:03 -0500
commit653a00c9662304ef72a3eb4e681c91720960e0b4 (patch)
tree5773757047d5c81f8d19d17bd331a5d13734766f /Makefile
parentcc0573b3250214034062ddf8c64359596d8af521 (diff)
ACPI: thermal fixup
The alias name may be used in _PSL, _ALx and _TZD, so we bind the cooling device only if the acpi_device node matches. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
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